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material_prop.yml
63 lines (53 loc) · 934 Bytes
/
material_prop.yml
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link:
density: 1250
specific_heat: 628.75
thermal_conductivity:
kx: 212
ky: 150
kz: 150
link_cu:
density: 8960
specific_heat: 385
thermal_conductivity: 398
link_si:
density: 2330
specific_heat: 710
thermal_conductivity: 150
ubump:
density: 2056
specific_heat: 52
thermal_conductivity: 30.94
tim:
density: 2500
specific_heat: 1000
thermal_conductivity: 10
substrate:
density: 1250
specific_heat: 1300
thermal_conductivity:
kx: 20.68
ky: 20.68
kz: 0.3783
lid:
density: 8960
specific_heat: 385
thermal_conductivity: 398
interposer:
density: 2330
specific_heat: 710
thermal_conductivity: 150
chiplet:
density: 2330
specific_heat: 710
thermal_conductivity: 150
c4:
density: 1250
specific_heat: 1300
thermal_conductivity:
kx: 0.6431
ky: 0.6431
kz: 2.348
adhesive:
density: 2500
specific_heat: 1000
thermal_conductivity: 1.9