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RSHP-MB.kicad_pcb
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(kicad_pcb (version 20211014) (generator pcbnew)
(general
(thickness 1.6)
)
(paper "A4")
(title_block
(title "RSHP-MB-0010")
(date "2022-05-29")
(rev "1.0")
(company "(c) Andriy Golovnya http://redscorp.net")
(comment 1 "Reflow Soldering Hot Plate - Mounting Board")
)
(layers
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(33 "F.Adhes" user "F.Adhesive")
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(35 "F.Paste" user)
(36 "B.SilkS" user "B.Silkscreen")
(37 "F.SilkS" user "F.Silkscreen")
(38 "B.Mask" user)
(39 "F.Mask" user)
(40 "Dwgs.User" user "User.Drawings")
(41 "Cmts.User" user "User.Comments")
(42 "Eco1.User" user "User.Eco1")
(43 "Eco2.User" user "User.Eco2")
(44 "Edge.Cuts" user)
(45 "Margin" user)
(46 "B.CrtYd" user "B.Courtyard")
(47 "F.CrtYd" user "F.Courtyard")
(48 "B.Fab" user)
(49 "F.Fab" user)
(50 "User.1" user)
(51 "User.2" user)
(52 "User.3" user)
(53 "User.4" user)
(54 "User.5" user)
(55 "User.6" user)
(56 "User.7" user)
(57 "User.8" user)
(58 "User.9" user)
)
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(layer "F.Cu" (type "copper") (thickness 0.035))
(layer "dielectric 1" (type "core") (thickness 1.51) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
(layer "B.Cu" (type "copper") (thickness 0.035))
(layer "B.Mask" (type "Bottom Solder Mask") (thickness 0.01))
(layer "B.Paste" (type "Bottom Solder Paste"))
(layer "B.SilkS" (type "Bottom Silk Screen"))
(copper_finish "None")
(dielectric_constraints no)
)
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(drillshape 0)
(scaleselection 1)
(outputdirectory "cam")
)
)
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