Skip to content

The sensor package (strain, temperature, vibration) for the 2024 UofC GNCTR tbogg. Designed as an R&D intrastructure monitoring solution.

License

Notifications You must be signed in to change notification settings

UofC-GNCTR-2024/Tbogg-Sensor-Package-PCB

Folders and files

NameName
Last commit message
Last commit date

Latest commit

 

History

10 Commits
 
 
 
 
 
 
 
 

Repository files navigation

Tbogg-Sensor-Package-PCB

The sensor package (strain, temperature, vibration) for the 2024 UofC GNCTR tbogg. Designed as an R&D intrastructure monitoring solution.

Main Components

  1. 2x Strain Gauge Blocks
  2. 1x On-PCB Temperature Sensor (STDS75DS2F)
    • I2C
  3. 2x In-Concrete Temperature Sensors
    • Thermistor-based
  4. 1x Vibration Sensor
    • Model: MPU-6050 Breakout
    • I2C Comms
  5. I2C Optical Flow Sensor
  6. Battery: 4x 18650
    • TODO: choose quantity, model, holder, and connection
    • In series
  7. Battery Management System: probably the 3V3 buck-boost from the balloon project
    • TODO: more info
  8. Wireless Comms: LoRa Wio E5
    • TODO: pull from balloon project
    • TODO: confirm that this model is good
  9. Microcontroller Unit (MCU)
    • ESP32 Breakout

Reference Links

  • TODO: fill

Revision Notes

  • PCB orders will each recieve a new revision number.
    • PCB orders will be in the format of "Rev1", "Rev2", etc.
    • GitHub Releases (and Tags) will be tagged in the format of rev1, rev2, etc.
  • BOM changes on PCB orders should be documented as minor revisions.
    • Example: rev1.1, rev1.2, etc.

About

The sensor package (strain, temperature, vibration) for the 2024 UofC GNCTR tbogg. Designed as an R&D intrastructure monitoring solution.

Topics

Resources

License

Stars

Watchers

Forks

Packages

No packages published